Wide band cross point switch using MEMS technology

ABSTRACT

A multilayer switching assembly for switching high frequency signals has MEMS structures on a ceramic substrate having a top surface  500 , a bottom surface and a plurality of insulating layers ( 510,512,514 ). The insulating layers are separated by at least a first conductor  502  and a second conductor  504 . The first conductor  502  is connected to a ground potential. The second conductor  504  is separated from the first conductor  502  by one of the insulating layers. The second conductor presents a specific impedance (50 ohms) with respect to the first conductor to high frequency signals traveling on the second conductor. 
     64 MEMS structures (e.g.  540,708,716,718, 720 ) are mounted on the top surface. Each MEMS has an input, an output, and a control. The input connected to the second conductor. The output is connected to a coplanar waveguide ( 508 ) placed on the top surface ( 500 ). The control is connected to the bottom surface. 
     The input to each MEMS is electrically separated from the output and from the control by a third conductor ( 534,550,532,530 ) connected to the first (grounded) conductor ( 502 ). The third conductor traverses one or more of the insulating layers thereby acting as a shield and precluding the high frequency signals presented to the input from propagating to the output and to the control. The 64 MEMS are arranged in a square 8 by 8 matrix, as well as their controls. High frequency inputs and outputs to be switched by the MEMS are placed on the periphery of the substrate to further enhance the separation of signals. Terminating resistors (50 ohms) are also placed near the periphery.

This is a division of application Ser. No. 10/143,180, filed May 9,2002, now U.S. Pat. No. 6,849,924.

BACKGROUND OF THE INVENTION

1. Field of Invention

This invention relates to the field of telephony, particularly forming across point switch using Microlectromechanical systems (MEMS) structuresmounted on a ceramic substrate.

2. Description of the Related Art

One aspect of the art of telephony involves interconnecting any of aplurality of inputs, N, to any of a plurality of outputs M. It isdesired to connect an input signal, part of N, carried on an incomingline, to an output, part of M, carried on an outgoing going line. Thisfunction is generally performed by an N×M matrix of crosspoints capableof interconnecting any member of N to any member of M. Such a structureof M×N crosspoints is a coordinate switch, that is, a rectangular arrayof crosspoints in which one side of the crosspoints is multiplied inrows and the other side in columns. A crosspoint is ideally a two stateswitching device having low transmission impedance in one state and veryhigh in the other, as defined by the Bell System Technical Journal,September 1964. When the number of crosspoints provided within theswitch is N×M, the coordinate switch has full availability and isnon-blocking, that is, at all times there is a path between any pair ofidle lines connected thereto, regardless of the number of paths alreadyoccupied.

A crosspoint in early mechanical telephone exchanges was a copper barsliding between two contacts for providing the necessary interconnectionbetween an input and an output as well as isolation between input andoutput. With the advent of electronic telephone exchanges, such asBells' Electronic Switching System (ESS line), the switching functionwas performed by solid state devices such as Field Effect Transistors,Metal Oxide Field effect transistors, CMOS gates and the like.Unfortunately, as the size of the N×M matrix grows, it becomes moredifficult to provide one single, massive, stage to interconnect allinputs and outputs. Instead, for example, a multi stage network isimplemented to reduce the total number of crosspoints as compared to theN×M matrix. T. L. Bowers, in Derivation of Blocking Formulae for 3 Stage“Folded” switching arrays IEEE paper No CP 63-1462 calculates the numberof crosspoints for a reduced (3 stage) configuration. The limitation tothe number of stages is that, unlike the single stage design, theswitched signal has to traverse a plurality of crosspoints within theexchange. Thus, if the basic element of a switch, the crosspoint, islossy, traversing a series concatenation of them may attenuate thesignal to a level where it is no longer usable, or the signal to noiseratio reduced below acceptable levels.

One approach for reducing the attenuation of a switching element is touse MEMS type structures having low insertion loss to perform theswitching function. Micro-Electro-Mechanical Systems (MEMS) is theintegration of mechanical elements, sensors, actuators, and electronicson a common substrate through the utilization of microfabricationtechnology. While typical electronics elements such as transistors arefabricated using integrated circuit (IC) process sequences (e.g., CMOS,Bipolar, or BICMOS processes), micromechanical MEMS structures arefabricated using process compatible micromachining processes thatselectively etch away parts of the silicon wafer or add new structurallayers to form the mechanical and electromechanical devices.

An example of a MEMS structure having a bidirectional rotating memberhaving two positions is described in U.S. Pat. No. 6,072,686,incorporated herein by reference in its entirety. Another example of aMEMS structure for microwave (millimeter wave) applications is describedin U.S. Pat. No. 6,046,659, incorporated herein by reference in itsentirety.

With the advent of higher operating frequencies, forming a switchingmatrix for use in telephony using MEMS structures requires specialconsiderations subject of this invention.

SUMMARY OF THE INVENTION

A multilayer switching assembly for switching high frequency signals hasMEMS structures on a ceramic substrate having a top surface 500, abottom surface and a plurality of insulating layers (510,512,514). Theplurality of insulating layers are separated by conducting layers, suchas a first conductor 502 and a second conductor 504. Another conductor,506, at ground potential, forms a stripline in conjunction with secondconductor 504 and first conductor 502. The first conductor 502 is alsoconnected to a ground potential. The second conductor 504 is separatedfrom the first conductor 502 by one of the insulating layers. The secondconductor 504, as part of a stripline, presents a specific impedance (50ohms) with respect to the first conductor to high frequency signalstraveling on the second conductor.

64 MEMS structures (e.g. 540,708,716,718, 720) are mounted on the topsurface. Each MEMS has an input, an output, and a control. The inputconnected to the second conductor. The output is connected to a coplanarwaveguide (508) placed on the top surface (500). The control isconnected to the bottom surface.

The input to each MEMS is electrically separated from the output andfrom the control by a third conductor connected to the first (grounded)conductor. The third conductor traverses one or more of the insulatinglayers thereby acting as a shield and precluding the high frequencysignals presented to the input from propagating to the output and to thecontrol.

The 64 MEMS are arranged in a square 8 by 8 matrix, as well as theircontrols. High frequency inputs and outputs to be switched by the MEMSare placed on the periphery of the substrate to further enhance theseparation of signals. Terminating resistors (50 ohms) are also placednear the periphery.

BRIEF DESCRIPTION OF THE DRAWING

In the Drawing:

FIG. 1 is an exemplary 8×8 crosspoint switch of the prior art;

FIG. 2 is an exemplary schematic of a switching building block using atypical MEMS structure;

FIG. 3 is an exemplary schematic of a 2 by 2 switch using 4 MEMSstructures;

FIG. 4 is an exemplary detail of MEMS structures reflecting FIG. 2;

FIG. 5 is an exemplary schematic of the layers used in the presentinvention vertical layout a;

FIG. 6 is an exemplary schematic of the layout of two MEMS structures ona substrate;

FIG. 7 is an exemplary schematic of the layout of four MEMS structureson a substrate;

FIG. 8 is an exemplary schematic of the layout of 64 MEMS structuresforming an 8 by 8 switching matrix;

FIG. 9 is an exemplary schematic of the layout of the input/output pinson the package associated with the 8×8 matrix of FIG. 8.

DETAILED DESCRIPTION

1. Introduction

This invention introduces the notion of using MEMS structures on acommon substrate to form, for example, an 8 by 8 switching matrix, aswell as other switching matrix configurations. Special provisions aremade to isolate the input from the output, thus insuring minimal signalleakage for OFF conditions across a MEMS structure.

FIG. 1 shows a an 8 by 8 matrix of crosspoints of the prior art. Any of8 inputs can be connected with any of 8 outputs. For example, input 15is connected to output 13 using cross point switch 11. Because there are64 cross point switches, this is a full availability, non-blockingswitching matrix. Each of the 64 switches is closed or opened inaccordance with a control signal applied to each switch. The controlsignals are not shown.

FIG. 2 shows the diagram of a typical MEMS structure 250, a buildingblock of the present invention. In FIG. 2, a signal applied to terminal210 can be switched to either terminal 230 or 220 upon a command appliedto terminal 260 and 262. Similarly, a signal applied to terminal 240,can be routed to either terminal 220 or 230 in accordance with commandinput A on terminal 260 and its complement A on terminal 262. The MEMSstructure used in this application, is further described in FIG. 4, hasfour command inputs, paired in two groups of two. The signals applied tothe two groups are the complement of each other. Only two of the inputsignals are shown for clarity in FIG. 2 and FIG. 4.

FIG. 3 shows a 2 by 2 switch 300 using four MEMS structures. The fourMEMS structures, 390, 391, 392 and 393 are interconnected to form the 2by 2 switch having two inputs 310 and 320, and two outputs, 330 and 340respectively, As shown, input 310 is connected into termination 387,while input 320 is connected into output 340. Terminations 385, 386,387,and 388 absorb high frequency signals presented to them (generally withno, or negligible reflection). Control input 350 controls the positionof interconnect means within MEMS structure 390. Similarly, control 360operates MEMS 391, control 370 operates MEMS 392, while control 380operates MEMS 393. It is clear to one skilled in the art thatinterconnecting 16 such 2 by 2 switches, and eliminating the redundantterminations, will yield an 8 by 8 matrix, similar in function to theone shown in FIG. 1.

FIG. 4 shows a multilayer switching assembly for switching a highfrequency signal using the principles of this invention. This assemblycomprises a MEMS structure 410 on a ceramic substrate. The ceramicsubstrate is made up of layers of ceramic, insulating material andconductive material, typically gold, silver, copper, palladium or otherthick film conductor metal. The MEMS structure has a first terminal 420,a second terminal 428, a third terminal 430, and a fourth terminal 418.Also provided is a first control input 412, a second control input 416,a third control input 432, and a fourth control input 426. Using theMEMS structure 410, the high frequency signal presented to said firstterminal 420 can be connected from said first terminal 420 to eithersaid second terminal 428 or said fourth terminal 418 in response to acontrol signal applied to said first control input 412 and said secondcontrol input 416. Control terminal 412 is connected to control terminal432 using a bond wire (bond wire not shown for clarity). Similarlycontrol terminal 416 is connected to control terminal 426 using a bondwire. The control signal presented to 416 and 426 is always logicallyopposite to that presented to 432 and 412.

Using some references to the vertical structure described in FIG. 5below, the MEMS structure 410 is mounted on an upper surface 500 of afirst (ceramic) insulating layer 510, a lower surface of said firstinsulating layer separated from an upper surface of a second insulatinglayer 512 by a ground conductor 502 connected to ground potential. Asignal conductor 504 is placed on a lower surface of said secondinsulating layer 512.

A first descender 434, made of a conductive material, traverses saidfirst insulating layer 510 and said second insulating layer 512, and isconnected to a signal conductor within signal layer 504, layer 504located on the lower surface of said second insulating layer 512. Firstdescender 434 is also connected to said first terminal 420.

First descender 434 is enveloped at a distance by a first conductiveshield 402. This first conductive shield 402 traverses vertically thefirst insulating layer 510 and the second insulating layer 512 as wellas the third layer 514 and the fourth layer 514. Conductive shield 402is connected to ground conductor 502 and 506 so as to shield descender434. Shield 402 precludes high frequency signal leakage within theceramic layers. Shield 402 is shown to be made of multiple conductivevias vertically traversing the layers. These vias are arranged in acircular pattern, as exemplified in 402 and 408, thus forming theexternal sheath of a coaxial structure. The distance between descender434 and shield 402 is chosen based on ceramic material characteristics,for a specific impedance of the coaxial structure to be presented bysaid first descender to the high frequency signal. This is typically 50ohms.

A second descender 436 traverses, like first descender 434, the firstinsulating layer 510, the second insulating layer 512, and is connectedto a second signal conductor, part of layer 504, on said lower surfaceof said second insulating layer 512. Second descender 436 is alsoconnected to the fourth terminal 418. The second descender (436) isenveloped at a distance by a second conductive shield 408. This secondconductive shield 408 traverses vertically the first insulating layer510 and the second insulating layer 512. The second conductive shield408 is connected to ground conductor 502. The distance is chosen topresent a specific impedance by the first descender to the highfrequency signal.

A first coplanar waveguide (CPW) 404 is connected to the second terminal428. This coplanar waveguide is positioned on the upper surface 500 ofthe first insulating layer 510. The first coplanar waveguide presentsthe typical 50 ohm specific impedance to the high frequency signal.

Similarly, a second coplanar waveguide 406 is connected to the thirdterminal 430. This second coplanar waveguide is also positioned on theupper surface 500 of the first insulating layer 510. The second coplanarwaveguide also presents a 50 ohm specific impedance to the highfrequency signal.

Control signals are delivered to first control 412 using a controlconductor 538 traversing all layers of the ceramic package.

Shield 424 around conductor 538 exemplifies shielding conductors 532 and534 in FIG. 5. Typically, bond wire 414 connects control conductor 538to first control 412. A typical bond wire performing the same functionis shown as bondwire 524 in FIG. 5. The other end of control conductor538 is on control solder bump 520, on the bottom surface 517 of theceramic package. Control solder bump 520 connects with control pinsshown such as 920 and 922 in FIG. 9.

Similarly, shield 422 shields control signals for second control input416 from high frequency interference.

Typically, high frequency signals have wavelengths between 0.01millimeters and 100 millimeter.

FIG. 5 details the vertical extent of a multilayer switching assemblyfor switching high frequency signals using MEMS structures 540, 542.This assembly comprises a substrate having a first layer 510 with anupper surface 500, a second layer 512, a third layer 514, and a fourthlayer 516 with a bottom surface 517.

The first layer 510, the second layer 512, the third layer 514, and thefourth layer 514 are made of an insulating material, typically aceramic. The first layer 510 is separated from the second layer 512 by afirst conducting layer 502. The second layer 512 is separated from thethird layer (514) by a second conducting layer (504), having segments,such as segment 539, part of the second conducting layer. Each of thesegments, such as 539 is electrically separate from the rest of thelayer.

The third layer 514 is separated from the fourth layer 516 by a thirdconductor 506. The first conductor 502 and the third conductor 506 areconnected to ground potential.

The segmented, second conducting layer 504 is spaced from the groundedfirst conductor 502 and third conductor 506 so as to form a striplinehaving a characteristic impedance along said segmented second layer 504.

A center conductor 528 traversing vertically the first layer 510, thesecond layer 512, the third layer 514, and the fourth layer 516. Thiscenter conductor carries the high frequency signals to be switched bythe MEMS structures 540, 542.

An outer conducting via 530, 532 is formed around said center conductor528. This outer via 530, 532, in the manner of 408, traverses the secondlayer 512, the third layer 514, and the fourth layer 514. The outer via530, 532 is made of a conducting material forms a conductive circle asshown in 402 and 408, and is electrically connected to the firstconductor 502 and the third conductor 506, thus to ground. The outer via530, 532 is spaced from the center conductor (528) to maintain thecharacteristic 50 ohm impedance along the length of said centerconductor 528. The function of the outer via 530, 532 is to shield thehigh frequency energy traveling along the center conductor 528 frompropagating outside its boundaries and interfering with other elementswithin the assembly.

Center conductor 528 is connected to a first end of a coplanar waveguide(CPW) 508. The CPW 508 is placed along the upper surface 500. The secondend of CPW 508 is connected using an input bondwire 522 to a first highfrequency input of a first MEMS structure 540.

A control conductor 538 traverses the first layer 510, the second layer512, the third layer 514, and the fourth layer 514, to connect a controlbondwire 524 to a control input contact point 520 on the bottom surface517 of the fourth layer 516. The control bondwire (524) is alsoconnected to a control input of the first MEMS structure 540. At leasttwo such control inputs are required to operate the MEMS structure 540.

On the other side of the MEMS switch, a first conducting descender 536is connected to an output of the first MEMS structure 540 using a highfrequency output bondwire 526. This first conducting descender 536traverses vertically the first layer 510 and the second layer (512). Thefirst conducting descender (536) is also connected to a first segment(539). The first segment 539 is part of the second conductive layer 504.The same first segment 539 is connected to a second riser 541. Thissecond riser 541 traversing vertically the first 510 and the secondlayer 512, and connected to a second high frequency input bondwire 546.This second input bondwire 546 is connected to a second MEMS structure542.

Vertical conducting structures 550, 552 and 554 further insure that aground layer is interposed between the input and output sections of aMEMS structure, as well as precluding propagation of high frequencyenergy along the layers. Vertical structure 552 connects to the bottomsurface 517 using solder bump 558. Similarly, conducting structure 554connects to the bottom surface 517 using solder bump 564. 558 and 564provide a convenient means for making the connection to ground. Multipleground connections are made using solder bumps 562 and 560.

FIG. 6 shows a multilayer switching assembly for switching a highfrequency signal comprising two MEMS structures. A first MEMS structure602 (as in FIG. 4, item 410) has a first terminal 420, a second terminal428, a third terminal 430, and a fourth terminal 418 to carry highfrequency signals. A first control input 412, a second control input416, a third control input 432, and a fourth control input 426 are usedto control the high frequency signal flow between the four terminals asshown in FIG. 2.

A high frequency signal presented to said first terminal 420 can beconnected from the first terminal 420 to either the second terminal 428or the fourth terminal 418 in response to a control signal applied tothe first control input 412 and said second control input 416.

A second MEMS structure 604 having a CPW terminal 606, an output 608,and an input 614 is also provided.

The first MEMS structure 410,602 and the second MEMS structure 604 aremounted, in accordance with FIG. 5, on an upper surface 500 of a firstinsulating layer 510, a lower surface of the first insulating layerseparated from an upper surface of a second insulating layer 512 by aground conductor 502 connected to ground potential. A signal conductorlayer 504 is placed on a lower surface of said second insulating layer.

A first descender 434 traverses the first insulating layer 510 and thesecond insulating layer 512, and is connected to a signal conductor 539on the lower surface of the second insulating layer 512. The firstdescender 434 is also connected to the first terminal 420.

The first descender 434 is enveloped at a distance by a first conductiveshield, e.g. 402 or 408. This first conductive shield (402 or 408)traverses the first insulating layer 510 and the second insulating layer(512). The first conductive shield 402 is connected to ground conductors502 and 506. The distance between shield 402 and first descender 434 ischosen for a specific impedance to be presented by the first descenderto the high frequency signal, typically 50 ohms.

A second descender 436 traverses the first insulating layer 510 and thesecond insulating layer 512, and is connected to a second signalconductor 539, part of the signal conductor layer 504 on the lowersurface of the second insulating layer 512. The second descender 436 isalso connected to the fourth terminal 418.

The second descender 436 is enveloped at a distance by a secondconductive shield (e.g. 402 or 408). This second conductive shield(402,408) traverses the first insulating layer 510 and the secondinsulating layer 512. The second conductive shield 408 is connected tothe ground conductors 502 and 506. The distance between the shield andthe second descender is chosen for a specific impedance to be presentedby the first descender to the high frequency signal. The specificimpedance is, as in the case of the first descender, 50 ohms.

A coplanar waveguide 610 is connected to the second terminal 428 of thefirst MEMS structure 602 and the CPW terminal 606 of the second MEMSstructure. The coplanar waveguide 610 is positioned on the upper surface500 of the first insulating layer 510. The coplanar waveguide 610presenting the 50 ohm specific impedance to the high frequency signal.

A terminating resistor 612 is positioned on the upper surface 500. Theterminating resistor 612 is chosen to match the specific impedance tosaid high frequency signal, 50 ohms. The terminating resistor 612 isconnected to the output 608. The input 614 is connected to a secondsignal conductor 616. The second signal conductor 616 is on the lowersurface of the second insulating layer 512. Positioning the highfrequency signal from input 614 on another layer, separate and distinctform the layer where CPW 610 is reduces the interference betweensignals, increasing the separation between on and off states of MEMSstructure 604.

FIG. 7 further details the multilayer switching assembly for switching ahigh frequency signal subject to this invention. The assembly shownshows four of the 64 MEMS detailed in FIG. 8. The four MEMS shown inFIG. 7 comprise a first MEMS structure 708 (same as 410 in FIG. 4)having a first terminal 758, a second terminal 756, a third terminal748, and a fourth terminal 722. Only a first control input 762, and asecond control input 728 are shown. A third control input (e.g. 432),and a fourth control input (e.g. 426) are also part of MEMS 708, asdetailed in FIG. 4, and connected using a bondwire, but not shown forclarity. The high frequency signal to be switched is presented to thefirst terminal 758 using first high frequency pin 710. The highfrequency signal and can be connected from the first terminal 758 toeither the second terminal 756 or the fourth terminal 722 in accordancewith diagram of FIG. 2, in accordance with the structure of FIG. 4. Thehigh frequency signal is switched in response to a control signalapplied to the first control input 762 and the second control input 728.The signal applied to control input 762 is logically opposite (oppositepolarity) to the one applied to control input 728. If control input 762is applied, control input 728 also needs to be applied, but of oppositepolarity.

The first terminal 758 is connected to a first CPW 706. This first CPWis connected to a first high frequency signal pin 710. Pin 710 islocated near the periphery of the substrate 700 to minimize interferencewith other parts of the assembly.

A second MEMS structure 716, also having a CPW terminal 754, an output736, and an input 750, a third control input 732 and a fourth controlinput 740 works in conjunction with the first MEMS structure 708. Asecond CPW 712 connects from CPW terminal 754 on the second MEMSstructure 716 to the second terminal 756 of the first MEMS structure708.

The first MEMS structure 708, the second MEMS structure 716, the firstCPW 706 and the second CPW 712 are mounted on an upper surface 700 of afirst insulating layer 510 of the ceramic substrate. As shown in FIG. 5,the lower surface of the first insulating layer is separated from anupper surface of a second insulating layer 512 by a ground conductor 502connected to ground potential. A signal conductor layer 504 is on alower surface of the second insulating layer.

A first descender 536 from output 736 of the second MEMS traverses thefirst insulating layer 510 and the second insulating layer (512), and isconnected to a signal conductor 714 on said lower surface of said secondinsulating layer 512. This signal conductor 714 is a segment of thesignal conductor layer (504), connects the first descender (536), alsoconnected to said output 736, to a second high frequency pin 738 locatedon the periphery of the substrate 700.

The first descender 536, connected to output 736, is enveloped at adistance by a first conductive shield (534,537,550). The firstconductive shield traverses the first insulating layer 510 and thesecond insulating layer 512 and the third insulating layer 514. Thefirst conductive shield (534,537,550) is connected to the groundconductor 502. The distance chosen for a specific impedance to bepresented by the first descender 536 to the high frequency signal.

Similarly, a second descender 746 (similar to descender 536), fromfourth MEMS 720, traverses the first insulating layer 510 and the secondinsulating layer 512, and is connected to a second signal conductor 726(similar to 539), part of said signal conductor layer 504 on said lowersurface of said second insulating layer 512. This second descender 746is also connected to a high frequency fifth terminal on a fourth MEMS720.

A first terminating resistor 704 is positioned on the upper surface 700.This terminating resistor 704 chosen to match the specific impedance tothe high frequency signal. The terminating resistor 704 is connected tothe fourth terminal 722.

The first control input 762, the second control input 728, the thirdcontrol input 732 and the fourth control input are uniformly located onthe substrate 700 so that the spacing separating the first control input762 from the second control input 728 is equal to the spacing separatingthe third control input 732 from the fourth control input 740. The samespacing also separates the second control input from the third controlinput.

The first high frequency output pin 710 and the second high frequencyoutput pin 738 are located on the periphery of said substrate 700, thusminimizing interference.

FIG. 8 details the layout of the present invention for a switchingassembly for switching any of 8 incoming high frequency signals to anyof 8 outputs (8 by 8 switch). It comprises 64 MEMS structures, (e.g.708,716,718,720) each of said 64 MEMS structures having a firstterminal, a second terminal, a third terminal and a fourth terminal, afirst control terminal and a second control terminal in accordance withFIG. 7.

The 64 MEMS structures are on a multilayer substrate having a squareperiphery, the square periphery having four equal sides, a top surface(500), a bottom surface and a plurality of insulating layers(510,512,514). The insulating layers, detailed in FIG. 5, are separatedby a first conductor (502) and a second conductor (504), said firstconductor (502) connected to a ground potential, said second conductor(504) separated from said first conductor (502) by one of saidinsulating layers, said second conductor presenting a specificimpedance, typically 50 ohms, with respect to said first conductor tohigh frequency signals traveling on the second conductor 504. Conductor504 forms the center conductor of a stripline, where layers 502 and 506form the ground conductors of the stripline.

The 64 MEMS structures mounted on said top surface forming a first 8 by8 array, where all the members of the array are equally spaced from eachother. The array has 8 inputs and 8 outputs disposed on the periphery ofthe substrate.

Each of 64 second terminals (e.g. 428 in FIG. 4, 754 in FIG. 7) and 64third terminals (e.g. 430 in FIG. 4, 756, 760 in FIG. 7) is connected toa CPW, the 64 CPWs are formed on the top surface (500) of the ceramiclayers.

Each of the 64 first terminals (420) and the 64 fourth terminals (418)is connected to a descender. Thus, 64 descenders are connected to 64second conductors 504.

Each of the 64 first control terminals for each MEMS switch are placedto form a second 8 by 8 array, its members also equidistantly spacedfrom each other.

Furthermore, each of the second 64 second control terminals are placedto form a third 8 by 8 array. Again its members are equidistantly spacedfrom each other.

The typical high frequency signals can have wavelengths between 0.01millimeters and 100 millimeter. These high frequency input signals aretransmitted t the 8 by 8 switching matrix by using package pins locatedoutside said first array made up of MEMS switches, or the second andthird array, along the periphery of the multilayer substrate.

16 resistors matching said characteristic impedance are provided on saidmultilayer substrate and connected to MEMS. Resistor 702 is connected toMEMS 720, while resistor 704 is connected to MEMS 708. Of the 16resistors, 12 are located outside the first array, the second array andthe third array. These are 702, 802, 804, 806, 808, 810, 812, 814, 816,818, 820, 822. These 12 resistors aligned along three sides of said foursides of the substrate, as shown. Resistors 824, 826 and 828 are locatedwithin the confines of array of MEMS. Resistor 704 is not aligned, butis proximate to MEMS 708.

FIG. 9 shows the bottom view of terminal arrangements of the packageusing the 64 MEMs of FIG. 8. Sample terminals 710, 738, 902, 904, 906,908, 910, 912 and 914 on the periphery of the package 900 carry highfrequency signals.

Sample terminals 920 and 922 carry control signals to each of theparticular MEMS they are directly located under. The path of a typicalcontrol signal is from a terminal such as 920, to a solder bump 520 (inFIG. 5), to a control conductor 528, to one of two control inputs (e.g.728 or 762) to the MEMS 540 via control bondwire 524.

Terminals such as 920 or 922 or 902 can be pins, solder bumps or anyconvenient means for making an electrical inter-connection as applicableto the package or substrate level.

A method for building a multilayer switching assembly for switching highfrequency signals using MEMS structures (540,542) is also envisioned.The method comprises the steps of:

1) Mounting a MEMS structure (540) on a ceramic substrate. The substratehas a top surface (500), a bottom surface and a plurality of insulatinglayers (510,512,514), said insulating layers separated by a firstconductor (502) and a second conductor (504).

The first conductor (502) is connected to a ground potential. The secondconductor (504) is separated from the first conductor (502) by one ofthe insulating layers. The second conductor presents a specificimpedance with respect to the first conductor to the high frequencysignals traveling on the second conductor. Another conductor istypically provided to form a stripline structure. The MEMS structure(540) mounted on the top surface has an input, an output, and a control.

2) Connecting the input of the MEMS to the second conductor.

3) Connecting the output of the MEMS to a coplanar waveguide (508)placed, or etched, on the top surface (500).

4) Connecting the control of the MEMS to the bottom surface of themultilayer assembly.

5) Separating the input from the output and from the control by a thirdconductor connected to the first conductor. The first conductor isconnected to ground. The third conductor traverses one or more of theinsulating layers thereby precluding the high frequency signalspresented to said input from propagating to said output and to saidcontrol and maintaining a characteristic impedance (typically 50 ohms)over the length of the third conductor.

All references cited in this document are incorporated herein in theirentirety.

Although presented in exemplary fashion employing specific embodiments,the disclosed structures are not intended to be so limited. For example,the principles used to form the 8 by 8 array can be used to form a 3 by12 array, or any combination of MEMS switches using the principles ofsignal shielding and separation disclosed herein.

Those skilled in the art will also appreciate that numerous changes andmodifications could be made to the embodiment described herein withoutdeparting in any way from the invention. These changes and modificationsand all obvious variations of the disclosed embodiment are intended tobe embraced by the claims to the limits set by law.

1. A switching assembly for switching any of 8 incoming high frequencysignals to any of 8 outputs comprising: 64 MEMS structures, each of said64 MEMS structures having a first terminal, a second terminal, a thirdterminal and a fourth terminal, a first control terminal and a secondcontrol terminal; a multilayer substrate having a square periphery, saidsquare periphery having four equal sides, a top surface, a bottomsurface and a plurality of insulating layers, said insulating layersseparated by a first conductor and a second conductor, said firstconductor connected to a ground potential, said second conductorseparated from said first conductor by one of said insulating layers,said second conductor presenting a specific impedance with respect tosaid first conductor to said high frequency signals traveling on saidsecond conductor; said 64 MEMS structures mounted on said top surfaceforming a first 8 by 8 array, said array having 8 inputs and 8 outputs,said 8 inputs and said 8 outputs disposed on the periphery of saidsubstrate; each of said 64 second terminals and said 64 third terminalsconnected to a coplanar waveguide (CPW), said 64 CPWs formed on said topsurface; each of said 64 first terminals and said 64 fourth terminalsconnected to a descender, said 64 descenders connected to said 64 secondconductors; each of said 64 first control terminals forming a second 8by 8 array; each of said 64 second control terminals forming a third 8by 8 array.
 2. An assembly as claimed in claim 1 wherein said firstinsulating layer and said second insulating layer are a ceramicmaterial.
 3. An assembly as claimed in claim 1 wherein each of saiddescenders and each of said CPWs presents a characteristic impedance tosaid high frequency signals.
 4. An assembly as claimed in claim 3wherein said characteristic impedance is 50 ohms.
 5. An assembly asclaimed in claim 1 wherein said high frequency signals have wavelengthsbetween 0.01 millimeters and 100 millimeters.
 6. An assembly as claimedin claim 1 wherein said high frequency input signals are transmittedusing package pins located outside said first array, said second arrayand said third array, along said periphery of said multilayer substrate.7. An assembly as claimed in claim 1 wherein said high frequency outputsignals are transmitted using package pins located outside said firstarray, said second array and said third array.
 8. An assembly as claimedin claim 1 wherein the 64 members of said first array are equidistantlyspaced.
 9. An assembly as claimed in claim 1 wherein the 64 members ofsaid second array are equidistantly spaced.
 10. An assembly as claimedin claim 1 wherein the 64 members of said third array are equidistantlyspaced.
 11. An assembly as claimed in claim 1 wherein 16 resistorsmatching said characteristic impedance are provided on said multilayersubstrate.
 12. An assembly as claimed in claim 11 wherein of said 16resistors, 12 are located outside said first array, said second arrayand said third array.
 13. An assembly as claimed in claim 12 wherein ofsaid 12 resistors located outside said first array, said second arrayand said third array are along three sides of said four sides of saidsubstrate.